Linear object removal method, linear object removal device, and electronic/electric apparatus component scrap processing method
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United States of America Patent
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Dec 27, 2022
Grant Date -
Jul 1, 2021
app pub date -
Sep 3, 2019
filing date -
Sep 3, 2018
priority date (Note) -
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Abstract
Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters including a plurality of rods 2 extending at distances in the feed direction and a beam portion 21 for supporting the plurality of rods 2 at one ends 2a of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; and feeding a raw material containing at least wire-form objects and plate-form objects into the vibrating sieve machine 1; and vibrating the filters 3 to sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine 1.
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