Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11532328
APP PUB NO 20190351449A1
SERIAL NO

16375157

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Abstract

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A multi-curing apparatus includes an actuator, a first chamber including a first energy source head, a second chamber including a second energy source head, a first driver including a first rotation transmission gear gear-engaged with the actuator, and a first driving gear gear-engaged with the first chamber. The apparatus further includes a second driver including a second rotation transmission gear gear-engaged with the actuator, and a second driving gear gear-engaged with the second chamber. The apparatus aligns a position of the first chamber with reference to a position of the second chamber while the first rotation transmission gear, the second rotation transmission gear, and the second driving gear are fixed.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jee, Won Young Seoul, KR 1 0
Kim, Min Uk Osan-si, KR 25 149
Kim, Sung Soo Hwaseong-si, KR 138 622
Nam, Woong Sik Seoul, KR 5 2
Oh, Se Young Yongin-si, KR 36 65
Park, Sung-Gyu Yongin-si, KR 13 16
Roh, Sung Ki Hwaseong-si, KR 1 0

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