Low thermal expansion alloy
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United States of America Patent
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Dec 20, 2022
Grant Date -
Apr 2, 2020
app pub date -
Apr 3, 2018
filing date -
Apr 4, 2017
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Abstract
A low thermal expansion alloy having a high rigidity and a low thermal expansion coefficient comprising, by mass %, C: 0.040% or less, Si: 0.25% or less, Mn: 0.15 to 0.50%, Cr: 8.50 to 10.0%, Ni: 0 to 5.00%, and Co: 43.0 to 56.0%, S: 0 to 0.050%, and Se: 0 to 0.050% and having a balance of Fe and unavoidable impurities, the contents of Ni, Co, and Mn represented by [Ni], [Co], and [Mn] satisfying 55.7≤2.2[Ni]+[Co]+1.7[Mn]≤56.7 and the structure being an austenite single phase.
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