Method for remedying sandy land by using simulated loam substrate spray-seeding technology
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United States of America Patent
Stats
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Dec 20, 2022
Grant Date -
Jul 22, 2021
app pub date -
Apr 19, 2019
filing date -
Aug 15, 2018
priority date (Note) -
In Force
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Abstract
A method for remedying sandy land by using a simulated loam substrate spray-seeding technology includes: first, carrying out a sand-fixing treatment to lay a metal mesh in sandy land, the metal mesh being fixed to the surface of the sandy land by a sand-fixing pile; second, spray-seeding a seed into the sandy land by simulated loam substrate spray-seeding; and finally, after spray-seeding, carrying out maintenance management, including adding a protective plate around the metal mesh, covering with a non-woven fabric, watering, fertilizing, reseeding, and post-monitoring. The present invention adopts a two-layer spray-seeding method, and rapidly simulates a loam substrate suitable for plant growth by bionics; the simulated loam substrate having good water retention capacity (conducive to a higher germination rate of seed), root development, microbial activity, nutrient transformation, and plant growth and development. With less investment and having a quick effect, large-scale sand control is provided.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
JIANGSU LVYAN ECOLOGICAL TECHNOLOGY CO LTD | NO 3 DINGXIANG ROAD YANGSHE TOWN JIANGSU 215600 |
International Classification(s)

- 2019 Application Filing Year
- A01G Class
- 1158 Applications Filed
- 660 Patents Issued To-Date
- 57 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Shen, Yifeng | Jiangsu, CN | 4 | 1 |
# of filed Patents : 4 Total Citations : 1 | |||
Zhang, Bo | Jiangsu, CN | 1006 | 7322 |
# of filed Patents : 1006 Total Citations : 7322 | |||
Zhang, Yuqian | Jiangsu, CN | 5 | 1 |
# of filed Patents : 5 Total Citations : 1 |
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Patent Citation Ranking
- 1 Citation Count
- A01G Class
- 74.26 % this patent is cited more than
- 3 Age
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- No Forward Cites to Display

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