SiC film structure
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United States of America Patent
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Nov 22, 2022
Grant Date -
Jan 7, 2021
app pub date -
Aug 28, 2019
filing date -
Feb 28, 2019
priority date (Note) -
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Abstract
A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; a lid configured to cover the opening; and a SiC coat layer configured to cover at least a contact portion between the main body and an outer edge portion of the lid and join the main body and the lid.
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