Reflow soldering system for combined convection soldering and condensation soldering

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United States of America Patent

PATENT NO 11504786
APP PUB NO 20210069810A1
SERIAL NO

17005590

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Abstract

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A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

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Patent Owner(s)

Patent OwnerAddress
REHM THERMAL SYSTEMS GMBH89143 BLAUBEUREN-SEISSEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rehm, Johannes Blaubeuren-Seissen, DE 8 371

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