Chip structure

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United States of America Patent

PATENT NO 11502052
APP PUB NO 20200321300A1
SERIAL NO

16910085

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Importance

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Abstract

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A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

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Patent Owner(s)

Patent OwnerAddress
NOVATEK MICROELECTRONICS CORPHSINCHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Chiao-Ling Hsinchu, TW 10 11
Li, Ling-Chieh Hsinchu County, TW 4 8

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