Heat dissipation structure of door leaf of LED display box

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11495720
APP PUB NO 20210057625A1
SERIAL NO

16997574

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation structure of the door leaf of an LED display box, comprising a box frame (100) and a box door leaf (200), a heat collection cavity (300) is simultaneously formed in the box frame (100) and on the backs of the LED display modules, when working, a number of the LED display modules are energized and emitting light, and the light is irradiated forward, and the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300), the box door leaf (200) comprises an outer door leaf plate (210) and an inner lining board (220), wherein the inner lining board (220) is arranged on the inner side (211) of the outer door leaf plate (210), and at the same time, a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210), the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300), the ventilation and heat dissipation channel (400) comprises an air inlet (410) and an air outlet (420), wherein the air inlet (410) is in communication with the heat collection cavity (300), and the air outlet (420) is arranged on the outer door leaf plate (210), the box heat source part (500) is fixedly connected to the inner side (221) of the lining board, and at the same time, the box heat source part (500) is located in the heat collection cavity (300).

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN CHIP OPTECH CO LTDSHENZHEN GUANGDONG 518108

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, XiaoGang Shenzhen, CN 20 131

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