System and method for reducing mutual coupling for noise reduction in semiconductor device packaging
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United States of America Patent
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Nov 1, 2022
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N/A
app pub date -
Feb 17, 2021
filing date -
Dec 30, 2020
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Abstract
A mechanism is provided to reduce noise effects on signals traversing bond wires of a SOC by forming a bond wire ring structure that decreases mutual inductance and capacitive coupling. Bond wires form the ring structure in a daisy chain connecting isolated ground leads at a semiconductor device package surrounding the semiconductor device. This structure reduces out-of-plane electromagnetic field interference generated by signals in lead wires, as well as mutual capacitance and mutual inductance.
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