Bottom electrode via structures for micromachined ultrasonic transducer devices
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United States of America Patent
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Nov 1, 2022
Grant Date -
Oct 15, 2020
app pub date -
Apr 9, 2020
filing date -
Apr 12, 2019
priority date (Note) -
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Abstract
A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.
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