Method for forming bump electrode substrate

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United States of America Patent

PATENT NO 11478869
SERIAL NO

17337551

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Abstract

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A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hattori, Takahiro Tokyo, JP 30 155
Okada, Hiroshi Tokyo, JP 247 2273
Souma, Daisuke Tokyo, JP 7 46
Sudo, Hiroki Tokyo, JP 17 13

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