Method for formation of patterned solder mask

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United States of America Patent

PATENT NO 11477894
APP PUB NO 20200288580A1
SERIAL NO

16811332

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Abstract

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A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and/or an electronic component comprising formation of said patterned solder mask is further provided.

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Patent Owner(s)

Patent OwnerAddress
PICOSUN OYTIETOTIE 3 02150 ESPOO 02150

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pudas, Marko Espoo, FI 28 20

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