Phase change memory and method of fabricating the same

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United States of America Patent

PATENT NO 11476417
APP PUB NO 20200373483A1
SERIAL NO

16988734

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A phase change memory and a method of fabricating the same are provided. The phase change memory includes a lower electrode, an annular heater disposed over the lower electrode, an annular phase change layer disposed over the annular heater, and an upper electrode. The annular phase change layer and the annular heater are misaligned in a normal direction of the lower electrode. The upper electrode is disposed over the annular phase change layer, in which the upper electrode is in contact with an upper surface of the annular phase change layer. The present disclosure simplifies the manufacturing process of the phase change memory, reduces the manufacturing cost, and improves the manufacturing yield. In addition, a contact surface between the heater and the phase change layer of the phase change memory of the present disclosure is very small, so that the phase change memory has an extremely low reset current.

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Patent Owner(s)

  • JIANGSU ADVANCED MEMORY TECHNOLOGY CO., LTD.; JIANGSU ADVANCED MEMORY SEMICONDUCTOR CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ming-Feng Hsinchu County, TW 11 44
Cheng, Sheng-Hung Hsinchu County, TW 6 38
Yang, Tzu-Hao Hsinchu County, TW 3 2

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