Methods of packaging thin metal films to maintain their physical characteristics
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United States of America Patent
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Oct 18, 2022
Grant Date -
Aug 12, 2021
app pub date -
Apr 30, 2021
filing date -
Apr 30, 2015
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Abstract
The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.
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