Stress measurement method, stress measurement device, and stress measurement system
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United States of America Patent
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Oct 11, 2022
Grant Date -
Nov 21, 2019
app pub date -
Jul 31, 2019
filing date -
Feb 10, 2017
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Abstract
In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.
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