Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission
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United States of America Patent
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Oct 11, 2022
Grant Date -
Jun 13, 2019
app pub date -
Dec 6, 2018
filing date -
Dec 8, 2017
priority date (Note) -
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Abstract
A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.
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