Solder alloy, solder ball, chip solder, solder paste and solder joint
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United States of America Patent
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Oct 11, 2022
Grant Date -
Aug 3, 2017
app pub date -
Feb 15, 2016
filing date -
May 26, 2015
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Abstract
A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.
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