Overmolded segmented electrode
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Oct 4, 2022
Grant Date -
Jul 2, 2020
app pub date -
Dec 18, 2019
filing date -
Dec 28, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
One aspect is forming a medical lead for implantation. The method includes forming a plurality of non-ground electrodes, at least one non-ground electrode having a plurality of segments. Overmold portions are formed for the at least one of the plurality of non-ground electrodes, including keys and tabs. One of a plurality of conductors is attached to one segment of the at least one non-ground electrode using the keys and tabs. The non-ground electrodes and plurality of conductors are assembled into electrode assembly and the overmold portions are reflowed. The reflowed electrode assembly is then ground to form the medical lead.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| EP | B1 | EP3673951 | Dec 18, 2019 |
| CN | A | CN111375125 | Dec 30, 2019 |
International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B23P:OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- A61N:ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY;....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
Cited Art Landscape
Patent Citation Ranking
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- H01L Class
- 0 % this patent is cited more than
- 3 Age
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