Radio frequency filtering of printed wiring board direct current distribution layer
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United States of America Patent
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Sep 20, 2022
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N/A
app pub date -
Dec 16, 2020
filing date -
Dec 16, 2020
priority date (Note) -
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Abstract
A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
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