Electronic module with single or multiple components partially surrounded by a thermal decoupling gap
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United States of America Patent
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Sep 20, 2022
Grant Date -
Mar 18, 2021
app pub date -
Sep 12, 2019
filing date -
Sep 12, 2019
priority date (Note) -
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Abstract
An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.
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