Soldering system including temperature distribution measurement control device, control method, and program
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United States of America Patent
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Sep 20, 2022
Grant Date -
N/A
app pub date -
Jan 26, 2018
filing date -
Jan 30, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.
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