Etchant composition and methods for manufacturing metal pattern and array substrate using the same
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United States of America Patent
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Sep 13, 2022
Grant Date -
Jun 4, 2020
app pub date -
Dec 4, 2019
filing date -
Dec 4, 2018
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Abstract
An etchant composition of an embodiment includes a persulfate, a four-nitrogen ring compound, a two-chlorine compound, a fluorine compound and water, and has a weight ratio of the four-nitrogen ring compound and the two-chlorine compound of about 1:0.5 to about 1:4. The etchant composition may etch a multilayer metal substrate of titanium/copper and may be used for manufacturing a multilayer metal pattern and an array substrate having excellent properties of etched patterns.
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