Package structure having substrate thermal vent structures for inductor cooling

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United States of America Patent

PATENT NO 11437346
SERIAL NO

16025710

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Abstract

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Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hill, Michael J Gilbert, US 49 815
Kulasekaran, Siddharth Tempe, US 4 9
Manusharow, Mathew Phoenix, US 11 33
Wojewoda, Leigh E Tempe, US 6 69

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