Surface mount fuse with solder link and de-wetting substrate

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United States of America Patent

PATENT NO 11437212
SERIAL NO

17395749

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Abstract

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A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE INC800 EAST NORTHWEST HIGHWAY DES PLAINES IL 60016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arciaga, Marko Batangas, PH 6 4
Dietsch, Gordon Todd Park Ridge, US 8 35
Nayar, Deepak Chicago, US 5 59
Retardo, Roel Santos Batangas, PH 5 1

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