Diode assembly and method of forming a diode assembly for pulsed fusion events
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United States of America Patent
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-
Sep 6, 2022
Grant Date -
N/A
app pub date -
Jun 27, 2019
filing date -
Jun 27, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A diode assembly for producing a pulsed fusion event in a z-pinch driver. The diode assembly includes an inner core formed of a fusionable fuel source material including a lithium compound formed of one or more lithium isotopes and one or more hydrogen isotopes. A lithium metal outer sheath is integrally formed around the inner core by decomposing a surface of the fusionable fuel source material.
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International Classification(s)
- 2019 Application Filing Year
- G21B Class
- 58 Applications Filed
- 26 Patents Issued To-Date
- 44.83 % Issued To-Date
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- 0 Citation Count
- G21B Class
- 0 % this patent is cited more than
- 3 Age
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