Temperature sensing device of integrated circuit
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United States of America Patent
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Sep 6, 2022
Grant Date -
Oct 14, 2021
app pub date -
Jun 18, 2020
filing date -
Apr 14, 2020
priority date (Note) -
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Abstract
The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.
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