Method for manufacturing lower housing of battery pack

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11431043
SERIAL NO

16491003

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing a lower housing of a battery pack having an embedded cooling pipe comprises the steps of: preparing a cooling pipe, which protrudes to the outside of the lower housing so as to be insert-connected to an external quick connector, includes a locking protrusion having a first outer diameter at a quick connector insertion part to be connected to the quick connector, and a second outer diameter for enabling the protrusion to be fixed to the quick connector in the inward direction in a first length at the end of the quick connector insertion part, and has a joint part which has a predetermined length and a third outer diameter corresponding to the second outer diameter in the inward direction in a second length longer than the first length at the end of the quick connector insertion part, and which is to be disposed over a cooling pipe inlet of the lower housing; preparing a slider including one or more pipe insertion parts having inner diameters corresponding to the third outer diameter of the joint part; inserting the quick connector insertion parts of the cooling pipes into the pipe insertion parts of the slider; coupling a lower housing mold to the cooling pipe; forming the lower housing by using the lower housing mold; and removing the slider and the lower housing mold.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG SDI CO LTD150-20 GONGSE-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO 17084 17084

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Wun Seok Yongin-si, KR 5 23
Keum, Jae Young Yongin-si, KR 1 0

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