Wafer supporting mechanism, chemical vapor deposition apparatus, and epitaxial wafer manufacturing method

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United States of America Patent

PATENT NO 11427929
APP PUB NO 20180371640A1
SERIAL NO

16063391

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Abstract

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A wafer supporting mechanism including: a wafer supporting table; and a movable part supported by the wafer supporting table, wherein the wafer supporting table includes a wafer supporting portion for transfer that stands up from a first surface opposing a back surface of a wafer to be placed and is provided further toward an inner side than an outer peripheral edge of the wafer to be placed, and the movable part includes a wafer supporting portion for film formation that is positioned further toward an outer peripheral side of the wafer to be placed than the wafer supporting portion for transfer and is relatively movable with respect to the wafer supporting table in a standing direction of the wafer supporting portion for transfer.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 ?1057325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Atsumi, Hironori Chichibu, JP 7 2
Fukada, Keisuke Chichibu, JP 20 22
Ishibashi, Naoto Chichibu, JP 27 44
Utashiro, Tomoya Hikone, JP 12 108
Yu, Jia Yokohama, JP 137 1391

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