Component communications in system-in-package systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11416050
APP PUB NO 20180321313A1
SERIAL NO

15589823

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Abstract

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A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

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Patent Owner(s)

Patent OwnerAddress
OCTAVO SYSTEMS LLC2277 PLAZA DRIVE SUITE 240 SUGAR LAND TX 77479

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Linder, Peter Robert Sugar Land, US 8 17
Troy, Kevin Michael College Station, US 4 5

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