In-field monitoring of on-chip thermal, power distribution network, and power grid reliability
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United States of America Patent
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Aug 16, 2022
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app pub date -
Mar 23, 2020
filing date -
Mar 23, 2020
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Abstract
Various embodiments may include methods and systems for monitoring characteristics of a system-on-a-chip. Various embodiments may include inputting, from a test data input connection, test data to a first scan chain section including a first group of logic gates located within a first region of the SoC. Various embodiments may include providing, from a first clock gate associated with the first region of the SoC, a clock signal to the first group of logic gates. Various embodiments may include measuring, using a first sensor, the characteristics at a second region of the SoC in response to providing the clock signal to the first group of logic gates. Embodiments may further include processing or analyzing measured characteristics to determine a testing result.
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