Mechanisms for supplying process gas into wafer process apparatus

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United States of America Patent

PATENT NO 11414759
APP PUB NO 20150152991A1
SERIAL NO

14093084

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Abstract

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Embodiments of mechanisms for processing a semiconductor wafer are provided. A method for processing a wafer includes providing a wafer process apparatus. The wafer process apparatus includes a chamber and a stage positioned in the chamber for supporting the semiconductor wafer. The method also includes supplying a process gas to the semiconductor wafer via a discharging assembly that is adjacent to the stage. The discharging assembly includes a discharging passage configured without a vertical flow path section.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Su-Horng Hsinchu, TW 28 981

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