Sputtering device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11414747
SERIAL NO

16446441

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Abstract

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A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Orimoto, Shinji Yamanashi, JP 13 10
Sone, Hiroshi Tokyo, JP 26 180
Suzuki, Naoyuki Tokyo, JP 63 524
Takei, Junichi Yamanashi, JP 13 9

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