Photosensitive resin composition, complex, laminated structure and display device, and electronic device including the same

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United States of America Patent

PATENT NO 11401468
APP PUB NO 20210095200A1
SERIAL NO

17120531

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Abstract

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A photosensitive resin composition includes (A) a photo-conversion material; (B) a metal-containing compound; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein the metal-containing compound includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, 5 V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure, a complex including a polymer matrix in which a photo-conversion material is dispersed, wherein the polymer matrix includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure and an ester linking group, a laminated structure including the complex, and a display device and an electronic device including the laminated structure.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Jooyeon Suwon-si, KR 26 225
Han, Hyunjoo Suwon-si, KR 10 40
Jun, Shin Ae Seongnam-si, KR 228 2736
Kim, Misun Suwon-si, KR 46 72
Kwon, Ha Il Suwon-si, KR 31 153
Lee, Bumjin Suwon-si, KR 36 77
Lee, Jongmin Hwaseong-si, KR 210 822
Yang, Hyeyeon Suwon-si, KR 25 131
Youn, Jinsuop Suwon-si, KR 20 56

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