Solder processing device
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United States of America Patent
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Aug 2, 2022
Grant Date -
Oct 1, 2020
app pub date -
Jun 12, 2020
filing date -
Mar 16, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.
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