Multi-die temperature control device and method for controlling temperature of multi-die power module
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United States of America Patent
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Jul 12, 2022
Grant Date -
Jul 23, 2020
app pub date -
Mar 1, 2018
filing date -
Mar 31, 2017
priority date (Note) -
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Abstract
The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.
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