Pressure sensor with external vertical electrical interconnection system
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United States of America Patent
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Jul 12, 2022
Grant Date -
Jun 11, 2020
app pub date -
Oct 25, 2019
filing date -
Dec 7, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.
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