Semiconductor device, communication system, and method of manufacturing semiconductor device

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United States of America Patent

PATENT NO 11381005
APP PUB NO 20200388932A1
SERIAL NO

17001643

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Abstract

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A semiconductor device includes a first antenna element, a second antenna element, and a semiconductor chip including a communication circuit that is connected to the first antenna element and the second antenna element. The first antenna element and the second antenna element are disposed on opposite surfaces of the semiconductor chip. The first antenna element or the second antenna element to which a ground potential is applied has a grid-like pattern.

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Patent Owner(s)

Patent OwnerAddress
LAPIS SEMICONDUCTOR CO LTD2-4-8 SHINYOKOHAMA KOUHOKU-KU YOKOHAMA 222-8575

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akahori, Hiroji Yokohama, JP 72 206

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