Slip-plane MEMs probe for high-density and fine pitch interconnects

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11372023
APP PUB NO 20210239734A1
SERIAL NO

17174191

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Abstract

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A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATIONCALIFORNIA USA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tadayon, Pooya Hillsboro, US 90 313
Walczyk, Joe Tigard, US 21 86

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