Capacitor with volumetrically efficient hermetic packaging
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United States of America Patent
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Jun 14, 2022
Grant Date -
Feb 25, 2021
app pub date -
Nov 5, 2020
filing date -
May 6, 2015
priority date (Note) -
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Abstract
An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.
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