Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

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United States of America Patent

PATENT NO 11359055
APP PUB NO 20200071464A1
SERIAL NO

16676501

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Abstract

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Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant:

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 ?1057325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Tomio Tokyo, JP 21 136
Mizuno, Yasuyuki Tokyo, JP 26 258
Murai, Hikari Tokyo, JP 53 260
Nagai, Yuki Tokyo, JP 29 236
Tanigawa, Takao Tokyo, JP 14 40

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