Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same

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United States of America Patent

PATENT NO 11355413
APP PUB NO 20200211920A1
SERIAL NO

16540495

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Abstract

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An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Yongwon Hwaseong-si, KR 30 49
Kang, Myung-Sung Yongin-si, KR 11 119
Kim, Yeongseok Hwaseong-si, KR 19 41
Lee, Joungphil Suwon-si, KR 7 12
Seo, Gwangsun Jeonju-si, KR 2 6
Yoo, Hyein Suwon-si, KR 9 53

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