Laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and manufacturing method therefor

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United States of America Patent

PATENT NO 11355275
APP PUB NO 20200058434A1
SERIAL NO

16492800

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Abstract

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A laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and a manufacturing method therefor. Parallel linear grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The linear grooves (20) are perpendicular to, or at an angle to, the rolling direction of the steel plate. A maximum height of edge protrusions of the linear grooves (20) does not exceed 5 μm, and a maximum height of spatters in etch-free regions between adjacent linear grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatters in the vicinity of the linear grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the etching effect of the finished steel is retained during a stress-relief annealing process. The steel is suitable for manufacturing of wound iron core transformers.

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Patent Owner(s)

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BAOSHAN IRON & STEEL CO LTD201900 NO 885 FUJIN ROAD SHANGHAI BAOSHAN DISTRICT SHANGHAI CITY SHANGHAI CITY 201900

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guo, Jianguo Shanghai, CN 5 3
Ji, Yaming Shanghai, CN 9 8
Li, Guobao Shanghai, CN 28 18
Ling, Chen Shanghai, CN 93 154
Ma, Changsong Shanghai, CN 7 26
Wu, Meihong Shanghai, CN 11 4
Xie, Weiyong Shanghai, CN 3 2
Yang, Yongjie Shanghai, CN 18 44
Zhao, Zipeng Shanghai, CN 16 11

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