Imprint method and imprint mold manufacturing method

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United States of America Patent

PATENT NO 11353789
APP PUB NO 20190384169A1
SERIAL NO

16543718

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Abstract

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An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.

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Patent Owner(s)

Patent OwnerAddress
DAI NIPPON PRINTING CO LTD1-1 ICHIGAYA-KAGA-CHO 1-CHOME SHINJUKU-KU TOKYO 1628001 ?1628001

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Saburou Tokyo, JP 4 12
Hikichi, Ryugo Tokyo, JP 2 4
Ichimura, Koji Tokyo, JP 15 107
Inazuki, Yuichi Tokyo, JP 3 6
Nagai, Takaharu Tokyo, JP 13 37
Suzuki, Katsutoshi Tokyo, JP 68 556

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