Heat transfer device for producing a soldered connection of electrical components
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United States of America Patent
Stats
-
Jun 7, 2022
Grant Date -
Jun 11, 2020
app pub date -
Feb 10, 2020
filing date -
Dec 9, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2020 Application Filing Year
- H01L Class
- 29783 Applications Filed
- 21134 Patents Issued To-Date
- 70.96 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 3 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Dec 7, 2025 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 7, 2029 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 7, 2033 |