Laser soldering system

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United States of America Patent

PATENT NO 11351622
APP PUB NO 20160346858A1
SERIAL NO

15234091

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Abstract

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A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

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Patent Owner(s)

Patent OwnerAddress
TE CONNECTIVITY CORPORATION1050 WESTLAKES DRIVE BERWYN PA 19312
TYCO ELECTRONICS (SHANGHAI) CO LTD200131 UNIT 5 UNIT 6 FLOOR 2 BUILDING 20 NO 999 YINGLUN ROAD CHINA (SHANGHAI) PILOT FREE TRADE ZONE PUDONG NEW AREA SHANGHAI SHANGHAI CITY SHANGHAI CITY 200131
TYCO ELECTRONICS (DONGGUAN) CO LTD523958 GUANGDONG PROVINCE HOUJIE TOWN OF DONGGUAN CITY INDUSTRIAL CITY TAIKELU NO 1 DONGGUAN CITY GUANGDONG PROVINCE 523958

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dubniczki, George J Mechanicsburg, US 3 6
Lu, Roberto Francisco-Yi Bellevue, US 182 150
Shen, Hongzhou Shanghai, CN 6 16
Zeng, Qinglong Guangdong, CN 39 62
Zhang, Dandan Shanghai, CN 117 218

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