Laminated electronic component and method for manufacturing laminated electronic component
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United States of America Patent
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May 31, 2022
Grant Date -
Apr 29, 2021
app pub date -
Jan 8, 2021
filing date -
Jul 13, 2018
priority date (Note) -
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Abstract
Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.
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