Laminated electronic component and method for manufacturing laminated electronic component
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United States of America Patent
Stats
-
May 31, 2022
Grant Date -
Apr 29, 2021
app pub date -
Jan 8, 2021
filing date -
Jul 13, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.
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International Classification(s)
- 2021 Application Filing Year
- H03H Class
- 1034 Applications Filed
- 655 Patents Issued To-Date
- 63.35 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H03H Class
- 0 % this patent is cited more than
- 3 Age
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