Conductive bonding structure for substrates and display device including the same
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United States of America Patent
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May 31, 2022
Grant Date -
May 5, 2022
app pub date -
Jul 2, 2021
filing date -
Nov 4, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate conductive bonding structure includes a lower substrate including a connection pad exposed to outside the lower substrate, an upper substrate including a transfer pad overlapping the connection pad, exposed to outside the upper substrate and including an upper surface, and a slit defined in the transfer pad, overlapping the connection pad and open at the upper surface of the transfer pad, the slit including an extending portion extending along a first direction and having a first slit width along a second direction crossing the first direction, and an expansion portion connected to the extending portion and having a second slit width along the second direction which is larger than the first slit width, and a solder contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad and into the slit.
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