Power semiconductor device with integrated current measurement
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United States of America Patent
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May 31, 2022
Grant Date -
Nov 19, 2020
app pub date -
May 11, 2020
filing date -
May 14, 2019
priority date (Note) -
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Abstract
A package-integrated power semiconductor device is provided, which includes at least one power transistor coupled to a current path, a current measurement device and a package. The current measurement device is electrically insulated from and magnetically coupled to the current path. The current path and the current measurement device are arranged so as to enable the current measurement device to sense the magnetic field of a current flowing through the current path. The at least one power transistor, the current measurement device, and the current path are arranged inside the package. Further, a power module assembly including the package-integrated power semiconductor device as well as a method of operating the package-integrated power semiconductor device are provided.
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