Method of embedding opto-electronic components in a layer
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United States of America Patent
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May 31, 2022
Grant Date -
Jun 27, 2019
app pub date -
Dec 20, 2018
filing date -
Dec 22, 2017
priority date (Note) -
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Abstract
A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.
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