Method and apparatus for cleaning semiconductor wafers
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United States of America Patent
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May 24, 2022
Grant Date -
Jun 25, 2020
app pub date -
Oct 30, 2019
filing date -
Dec 14, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a method and a cleaning apparatus for cleaning semiconductor wafers. The cleaning apparatus includes a plurality of cleaning tanks, a dipping tank, a first robot hand, a second robot hand, and at least one drying chamber. The plurality of cleaning tanks is configured to clean a plurality of wafers held by a cassette by cleaning agents. The plurality of wafers is cleaned in the plurality of cleaning tanks through a batch process. The dipping tank is configured to rinse the plurality of wafers by a replacement agent. The at least one drying chamber is configured to dry the wafer taken by the second robot hand with single wafer process.
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